Thermal Conductive Gap Pad

  Silicon Thermal Conductive Gap Filler Pad   Features: 3.00 W/mk thermal conductivity  Low Thermal Resistance at Low Pressure Naturally tacky for easy application  Applications:Between heat-generation component and heatsink  Led Solid State Lighting, Graphices Cards, Telecom device Wireless communication hardware Cooling Module, Thermal module. High Power supply/conversion  Silicone Thermal Conductive Gap Filler Pad could reach 6.0 W/mk Between heat-generation Component and heat sink Automotive engine control, Graphices Cards,Telecom device Wireless Hub,Military equipment, power supplyCooling Module, Thermal module, 1. High bond strength to surfaces 2. Thermal conductivity in combination with electrical isolation 3. Excellent wet out 4. High temperature stability Application: 1.For CPU, LED,PPR heat sink, microprocessor 2.For any power consumption semiconductor 2.Replacing screws, fasteners and other fixed means 4.Fixing heat sink on the power supply circuit board 5.Fixing heat sink on vehicle control circuit board 6.Fixing heat sink on packaged chips   wecould die cut any size and shapes as customer design.   TP-600 TEST ITEM TEST MOTHOD UNIT VALUE SIZE mm 400*200MM COLOR Visual  Blue THICKNESS ASTM D374 mm 0.3-10MM GRAVITY ASTM D792 g/cc 2.85±0.1 HARDNESS ASTM D2240 Shore 00 25±5 TENSILE STRENGTH ASTM D412 kg/cm2 55       ELONGATION ASTM D412 % 60 95 TEMP EN344 ℃ -40~+2.