Thermally Conductive Adhesives

United Adhesives Inc. makes thermally conductive adhesives (TCA) for bonding electronic devices with heat dissipations. The two-part products have following features:
- High thermal conductivity & heat dissipating capacity
- High bonding strength to most common plastics and metals
- Flexible cure profile. Some are room temperature curable
- Automated dispensable and printable
- Soft and flexible to couple thermal stress while dissipating heat
- High dielectric strength for voltage insulation
Structural bonding epoxy based thermally conductive adhesives are also available.
Potential Uses
For high heat dissipation bonding in automotive electronics, semiconductors, and telecommunications, typically applied between high heat power device and heat sink; or any places where require coupling thermal stress while dissipating heat, or require thermally conductive vibration dampening; attachment of PCB to heat sink, cooling fans to devices, bonding or encapsulation of powder devices.