Thermoelectric Cooler

We are offering thermoelectric cooler
ata is used to cool (or heat) objects in containers. Heat is absorbed and dissipated by heat exchangers equipped with fans. Simply cut a hole, plug in the assembly and connect it to a power source. Our ata cooler is designed for dependable, compact performance. All models are optimized for a variety of voltages, delta t and efficiency, and powercool range delivers performance from 20 w to 193 w, typical applications include cooling electronics cabinets, analytical instruments, commercial refrigeration, food transportation boxes and small electronics enclosures
heat sink
we provide various type of heat sink per customer request
thermal interface material
agp series is a series of high performance, cost effective thermal interface material.
agp-gon is used where electrical isolation is not required. Its unique grain-oriented, plate-like structure allows it to conform exactly to surfaces, thus maximizing heat transfer. Agp material can be supplied in sheets, in rolls, or die cut to specific configurations. It is available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, thereby minimizing any impact on thermal performance.
we also provide insulator thermal material and other thermal solution material.
features and benefits
high thermal conductivity of 5 w/mk in z axis and 140 w/mk in the x-y axis
greater than 98% graphite
low thermal resistance
thicknesses of 0.005", 0.010" and 0.020" (0.125 mm, 0.25 mm, and 0.50 mm)
applications
power conversion equipment
power supplies
large telecommunications switching hardware
notebook computers
atc is solid state heat pumps that utilize the peltier effect. During operation, dc current flows through the module causing heat to be tranferred from one side to the other, creating a cold and hot side. A single-stage module can achieve temperature differences up to 70°c, or can transfer heat at a rate of 125 w. To achieve greater temperature differences (up to 131°c), select a multistage (cascaded) module. To increase the amount of heat transferred, the modular design allow the use of multiple modules mounted side-by-side
features and benefits
quick cooling to below ambient - economically
reduced space, size and weight
reliable solid-state operation - no sound or vibration (lifetimes of more than 200,000 hours!)
precision temperature control capability
minimum, if any, electrical noise
dc operation
heat or cool by changing direction of current flow
more than 150 standard types available, from sub-miniature, low capacity to compact, high capacity
multistage cascades to below -100°c, standard or designed to specifications
atl-thermoelectric liquid cooler
our solid-state technology provides the most in performance, reliability and precise temperature control over conventional compressor based systems. The new atl series chillers have been redesigned to simplify assembly, which translates into cost savings for our customers. The pump capacity has increased to improve the cooling efficiency and heat transfer of a liquid circuit. The fan noise has been reduced for quieter operation in a lab environment setting. So, whether you work with lasers in the photonics, semiconductor, medical or lab science industries, demand the best.
bojin series of semiconductor refrigeration device is a specially designed for airtight industrial electrical ark, communications cabinets and design of industrial cooling device, mainly used in telecommunications, medical, industrial industries, refrigeration capacity range from 355w 15w, dc input, to 48vdc 12vdc, 24vdc
1 product application
communication stations battery warehouse
outdoor battery
gcv small electrical ark
2 advantages of product
(1) wide voltage range of use -44vdc~60vdc
(2) overheating protection function, prevent abnormal conditions lead to refrigeration chip burned
high reliability chip
refrigeration chip high reliability using gl structure
to realize high temperature differential refrigeration, chips can be more widely used
chip can run at higher temperature, use high melting point (235 degrees) solders, the highest heat temperature 150 degrees
semiconductor chips for resistance to wet closed
allow maximum compression load 1mpa
(3) using high reliability fan
(4) have to make mold with heat two working mode
(5) function of hydrogen with row
(6) green no refrigerants, zero emissions, zero pollution
(7) safe and reliable no compressor, no filter drier, no expansion valve, no sliding parts
(8) small volume, easy to install, intelligent temperature control, remote control, noise is small, refrigeration, two patterns automatically switch