Underfilled Adhesive 5218, Packaging Type : red

Product brief introduction
Federal 5218 filler belonging to a single component of fast curing epoxy filler.
Curing temperature is 120 degrees, good flowability, filling the gap of less than 25
microns, same viscosity of the glue, has excellent flexibility and maintainability.
Typical useing:
Mainly for the protection after filling the CSP; BGA and UBGA .
For example: mobile phones, laptop computers and so on.
Characteristics before curing:
Basal chemical material composition:Epoxy resin.
Outlooks: Light yellow transparent liquid.
Essencials technologies of Using this glue:
Before using must remained to room temperature ( 30ml
packages need to warming more than 2H; 250ml packages need to warming more than 4H ).
Can be directly filled under room temputure, In need of accelerating the filling speed
of PCB board, preheat the PCB and the temperature should be below 90 DEG c..
Recommend dispensing pressure 0.10-0.3Mpa, dispensing velocity of 2.5-12.5mm / s. For
a large area of the chips,glue injection can be divided to two or three times .
At a temperature of 20 DEG C,it can be used for 6 days; Unused glue sealed and refrigerated for 2-8 C.
Suggest curing conditions : at 120 degrees C for 5 minutes; at 150 degrees C for 3
minutes. Curing speed depend on the heating device and bonding element's size, so adjustthe curing time according to the actual fact.
Repair and cleaning
Have a repairance when the mechanical defects , simply by heating the chip until the temperature reaches the solder melting,carefully twist element, destroyed the adhesive layer, take element with vacuum suction or tweezers and clean with brush and isopropanol cleaning, not excessive force.