- MOQ5 Kilogram
- size350ml
- Supply TypeManufacturer
- Preferred Buyer Location All over the world
5219 Underfill is a kind of one component,fast curing epoxy filling agent.Curing Temperature is 120℃,excellent liquidity,filling the gaps below 25 microns ,viscosity consistent,high flexibility and maintained performace. Mainly for filling and protection after the CSP;BGA and UBGA’s assembly.Such as:Mobile Phone and laptop.
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