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Contact SupplierLaser cutting machine usage the machine is used in cutting,opening the window and uncovery for cvlfpcrf and thin multilayer board, as well as cutting a variety of substrates, such as ceramic, silicon etc. Feature (1)precision: adopting high-precision linear motor modules, servo control, sizing compensate, optical positioning and secondary positioning technologies. (2)high quality (a)little carbonization; (b)high density graphics cutting. (3)highly intelligent, efficient (a)with multi-panels cutting, auto-positioning, auto-correcting, automatically focus, automatic sizing compensation and exclusive cutting previews functions; (b)jg16 use double working table to save time of feeding and blanking materials.