
Company Information
Ask for more detail from the seller
Contact SupplierAdjustable repetition frequency
Modular design
TEM00 output
High average power output, up to 30W
Leveraging the extremely small heat-affected zone of "cold processing", it can achieve ultra-fine processing and microstructure production of non-metallic brittle materials in the high-end manufacturing fields, which is widely used in the 3C industry, especially in the key processes of cellphone industry chain. At present, more than 15,000 machines have been launched, leading the market share of similar lasers.
Applications
1. PCB, FPC marking, de-panel, cutting and drilling;
2. Silicon wafer micro-hole and blind hole processing;
3. Solar cell process
4. Silicon wafer scribing
5. Ceramic scribing, cutting and drilling
6. Removal of printing ink, PVD coating
7. Material surface marking