Vitrified Bond Grinding Wheels

Grinding wheels(Vitrified-bond Wheels)

The Vitrified-bond wheels are porous,which mainly used for back thinning of wafer.This Kind of grinding wheels also have a long life and high-speeding.
Feature

• ØPorous
• ØHigh-speed(Vmax=500μm/min)
• ØLong life and good quality
• ØOffer variety of special requirements.

Material of workpieces

• Discrete device, silicon wafe

How To Make An Order

• More details for your description,more proper blades or wheels you could get,please let us know :            
  
  • Type : such as 1A8.1V8,1E8...  
  • Size:Diameter, Thickness, Hole, Width and depth of abrasive layer, angle Specification Abrasive(D or CBN), Grit, Bond, Concentration  
  • Work-piece Material, Grinding process (wet or dry)