Wire Saw Machine, Brand Name : Dacheng, Dimension : 450X300X300

This machine is specially designed for the solar silicon wafer industry, and it is suitable for cutting poly silicon, mono crystalline silicon and other silicon materials.

 * greatly improve cutting efficiency and reduce processing cost;

* After years of high precision servo control technology, ultra-thin silicon wafer and ultra-fine diamond wire can be precisely cut and processed.

  Diamond wire special machine, high open probability, greatly improve cutting efficiency and reduce processing cost;

* After years of high precision servo control technology, ultra-thin silicon wafer and ultra-fine diamond wire can be precisely cut and processed.

* With stable operation and process oriented equipment design concept, to achieve the best technology solidification in the equipment, to create the maximum value for the customer.