
Company Information
Ask for more detail from the seller
Contact SupplierThis machine is specially designed for the solar silicon wafer industry, and it is suitable for cutting poly silicon, mono crystalline silicon and other silicon materials.
* greatly improve cutting efficiency and reduce processing cost;
* After years of high precision servo control technology, ultra-thin silicon wafer and ultra-fine diamond wire can be precisely cut and processed.
Diamond wire special machine, high open probability, greatly improve cutting efficiency and reduce processing cost;
* After years of high precision servo control technology, ultra-thin silicon wafer and ultra-fine diamond wire can be precisely cut and processed.
* With stable operation and process oriented equipment design concept, to achieve the best technology solidification in the equipment, to create the maximum value for the customer.