ZSH618 Dicing Saw, Brand Name : HB for Semiconductor, Wafer

the zsh618 dicing saw machine is our classic configuration model which has the advantages of compact structure, low cost with high performance, less area occupied. The machine has mounted with lcd touch screen, man-machine operation interface; the image alignment of the work piece is simple and convenient to improve the operation convenience. The self design software is used in the control system to improve the cutting efficiency. The equipment has high reliability, low cost maintenance and stable performance the additional functions allowing this zsh618 to dicing material structures as quadrilateral, hexagon, polygon with varies depth and division, customization is also available. Featurernsmall size with compact structure;rninteractive man-machine operation interfacern15� high resolution touch screen;rneasy operation, highly working efficiency;rnauto-aligning and auto focusing;rnsafety and reliable mechanism to avoid misoperation. Applicationrnsemiconductor chip, led, ic, ntc, pcb, quartz and sapphire, photovoltaic wafer, lithium niobate, ceramic, gallium arsenide, glass, etc.