Write a Review
Our Product / Services
We offer a complete product range of Groove Grinding Machine
The LGG is designed to grind and regroove thewire guides from slurry wafering saws or diamondwire saws to any pitch size.
The machine is designed to regrind OD and regroove the wire guides from e. g. Logomatic (Diamond Multi Wire Saw), Linton, HCT, Meyer+Burger, Themis, NTC-Japan, Toyo and Takatory and all other slurry or diamond wire saws, which need refurbishing of wire guide rolls. This machine can grind OD sizes from 2 13 inches (50-350 mm), with high precision pitch for a length from 100 1000 mm.
TESSCORN NANO SCIENCE INC. (TESSCORN NANO SCIENCE INC.)
1285, 5th Main, 17th Cross
HSR Sector 7
Bangalore 560068, HSR Layout, Karnataka
Share us via
