Hermetic lids to meet your microelectronic packaging requirements whether for the semiconductor, MEMS, medical or optical market. Our product line encompasses a full range of lids that can be customized to your specific application. View our lid application comparison chart. Available lids include: Combo-Lids - for high reliability applicationsMicro-Lids - for packages smaller than .300 in2 Seam Seal-Lids - for sealing heat sensitive electronicsSolder Reflow-Lids - a cost alternative to the Combo-Lid Visi-Lids - for optical packagesNon-Magnetic Lids - for specialty applicationsCeramic Combo Lids - for specialty applicationsEpo-Lids - Epoxy-coated ceramic for commercial application
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(Materion Advanced Materials Group)
Buffalo, NY 14214, United States
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