Shanghai Royal Technology Inc.

IPG is a short writing of Ion Plating Gold, which it is a technology of arc and sputtering combined to deposit Gold thin film on luxury products, especially on jewerly indusry like: necklace, wedding rings, ear rings, watches, handbag accessories etc.

The Jewelry materials are mostly stainless steel 316L, brass, or alloy. After exclusively pre-treatment, jewelry manufactures can use our IPG gold plating machine directly to get the 18K rose gold or 24K real gold coatings, which highly enhance the products life and value.

Decorative hard coatings have to meet variety of requirements such as attractive colors and high wear resistance. For luxury consumer goods such as watch components, writing instruments or spectacles, some manufactures want to maintain both the high wear resistance of PVD and the gold plate label which provides the product with a high quality image. So a 3 to 5 m layer of gold plating must therefore be deposit onto a (TiN+Au) PVD layer. This multi-layer method creates a high level of internal stress leading to adhesion defects. A complete process has to be set up in order to reduce the internal stress leading to adhesion defects.

Royal Technology has developed and produced 6 sets IPG exclusively using machine for coating service ceneters. The IPG machine main components:

1. Cylinder Arc unit or ( steered circular cathodic arc sources)

2. Planar Ion Source for Plasma cleaning before PVD coating

3. DC Sputtering Cathode of Ag ( Gold) deposition

4. MF Sputtering Cathode of TiN film coating

Summary:The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing

methods: DBC LTCC HTCC, much lower production cost is its high feature.

Royal technology team assisted our customer to developed the DPC process successfully with PVD sputtering technology.

Keywords:Ceramic sealing parts, DPC process, Copper PVD Sputtering system, LED Ceramic Chips With Cooper Plating, Al₂O₃, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor

Applications ofDPC:

HBLED

Substrates for solar concentrator cells

Power semiconductor packaging including automotive motor control

Hybrid and electric automobile power management electronics

Packages for RF

Microwave devices

DPC Technology Performance

Various substrate materials: Ceramic (Al3O2, AlN), Glass, and Si

• Much lower production cost.
• Outstanding thermal management and heat-transfer performance
• Accurate alignment and pattern design
• Robust metallization adhesion

Features:

• High throughput up to 2.2 Ceramic substrate per cycle;
• Strong adhesion with powerful heating-up device and plasma source cleaning;
• Compact design and with easy access for upgrading and maintenance work.
• Fully Automation, PLC+Touch Screen, one-touch control system.
• High efficiency with less power consumption, max. 50% production cost saving.