This family of unique composite materials consists of tungsten combined with copper. The refractory metals are insoluble in copper. They do not form alloys & cannot be made by conventional melting & casting methods. Instead they are made by powder metallurgy techniques. Certain...
Tungsten Copper alloy is an alloy composite of Tungsten and Copper which has the combination s of the excellent properties of Tungsten and Copper, such as heat resistance, aberration resistance, high density, excellent thermal and electrical...
Chromium Copper are used for their high strength, corrosion resistance and electrical conductivity. The chromium copper alloys are age hardenable, which, in this case, means that a change in properties occurs at elevated temperature due to the...
Copper to have higher mechanical properties and to be capable of use at elevated operating temperatures while still retaining the good conductivity for which it is selected in the first place. The high-copper alloy family includes Beryllium Coppers,...
Copper tungsten is a mixture of copper and tungsten. As copper and tungsten are not mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one. The micro structure is therefore rather a metal matrix composite instead of a...
Product Name : Quantifoil 7x7um (2um Bar) 300 Mesh Copper (Pack of 10)
Supply Type : Manufacturer
Quantifoils ® , produced by semiconductor lithographic techniques, are 15 - 20nm thick perforated carbon films with precise, well defined hole sizes, shapes and arrays. Quantifoil support films provide a high percentage of open area in addition to...
Product Name : Quantifoil 1.2um Dia (1.3um) 300 Mesh Copper (Pack Of 100)
Supply Type : Manufacturer
Quantifoils ® , produced by semiconductor lithographic techniques, are 15 - 20nm thick perforated carbon films with precise, well defined hole sizes, shapes and arrays. Quantifoil support films provide a high percentage of open area in addition to...
Product Name:Â Graphene On Lacey Carbon 300 Mesh Copper TEM Grids Purity: 99.9% FET Electron Mobility on Al2O3: 2000 cm2/Vs Hall Electron Mobility on SiO2/Si: 4000 cm2/Vs CAS No: 7782-42-5...