Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable...
Kohesi bond tuf 1621 aoht is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing nasa standards for low outgassing (astm e-595) and has a convenient 1:1 (part a: part b) mix ratio by...