Write a Review
Our Products
Our product range contains a wide range of Wafer Cutting Apparatus
The wire cutting machine "WCM" is manually operated and cuts wafer blocks to small wafer fingers of predetermined dimensions. The cutter frame and feed bar can be exchanged to produce other size of biscuits. The machine is used for cutting of small scale output.
| Technical Details | WCM |
| Plate Size in mm | 270 X 3750 |
| Out put wafer sheets.hr | Stack Height (mm) 10 to 70 |
| Electric Heating: Connected load in KW | Min. Cutting Wisth 16 |
| Cream Filled wafers.Hour** (Kgs appx.) | Cutting Wire Spring Steel in mm 0.5 |
| Dimensions (approx.in mm) | |
| Length | 1450 |
| Width | 1130 |
| Height | 675 |
| Weight (approx) | 110 |
| Net | 130 |
| Gross | 200 |
| Shipping Volume(CBM) | 1 |
Tanvi Pamnani (R & D Engineers)
A-41, Kukatpally Phase II, Road No.4 via. I. E, Gandhi Nagar, Hyderabad - 500 037, Telangana - 500037, India
Share us via
