SCB Interconnection Solutions Pvt Ltd

Outer Ring Road, Bangalore, Karnataka

Enabling High Yield Volume Production of Fine- Feature PCBsExposure on all UV, dry or liquid resists Imaging on inner and outer layers, SBU, flex PCBs and solder maskCompatible with Yellow Room environment.

The systems feature Orbotechs patented LSO Technology which can image ultra-fine lines down to 8m. For the FC-BGA/FC-CSP production our field proven system supports SAP and modified versions of SAP processes, while ensuring pitch down to 20m. For advanced BGA/CSP subtractive production, our system provides throughput of up to 160prints per hour Nuvogo LDI for Mass production.Nuvogo LDI for Mass production.

NuvogoTM 800 is a leading Direct Imaging (DI) solution for mass production digital imaging of fine-line HDI, Flex, Rigid-Flex and MLB applications. This cutting-edge system is powered by the new MultiWave Laser Technology, which simultaneously generates a multi-wavelength laser beam, offering maximum robustness on a vast range of resist types. Based on Orbotechs field-proven Large Scan Optics (LSO) Technology, the system is designed for unprecedented throughput of up to 7, 000 panels per day, helping to decrease overall cost of ownership while .maintaining optimal quality at high speed

The ProVia drillers provide the ultimate processing workstation for rigid boards, with high performance beam positioning for rapid point-to-point drilling and routing complex features. Choose a UV-only model, a CO-only model, or the hybrid version with both laser sources. The CO laser is appropriate for high speed drilling, cutting and skiving of dielectrics, while the UV laser is able to machine copper and provide higher process quality in many dielectrics. Whether your application is with glass- and aramid-reinforced epoxies or non-reinforced materials (e.g.resin-coated foil or polyimide), there is a ProVia model to meet your requirements.

ProVia Series

Integrated laser drilling / cuttingtool for high volume production

• High performance beam positioning for rapid, accurate panel processing
• CO 2, UV, and hybrid (UV+CO2) processing
• Zoom telescope provides continuously variable spot sizes
• Optional automatic load/unload and slip sheet handling
• Optional beam homogenizer for flat-top CO2 spots