Mass VIA Filling Machine
Vacuum Plugging Machine VCP5000-1
- Panel is placed inside themachine and vacuum is optionallydrawn inside the chamberdepending on the hole fill requirements
- Utilizing a similar principle as the hand-held unit, compressed air is used to force the material into a designated head and then through the via holes
- Depending on factors, such as hole quality and paste rheology, holes up to 1:40 aspect ratio can be filled; the vacuum is not needed for through-holes
- Cu plated blind vias can be easily filled without any voids utilizing the vacuum
- Excess material is removed by squeegee system
Via Hole Filling VHF 300V w/ a Vacuum function
- Flexible plugging machine allowing different types of panels and pastes to be processed
- handles boards at the extreme ends of the board thickness spectrum (up to 350 mil)
- minimizes consumption and waste of paste (smaller heads can be used)
- Max. panel size 24 x 30
- Thickness range is up to 350 mil thick
- 480 Volt, 3 Phase power connection, 4 kW
- The touch panel display allows up to 50 recipes to be stored
- Head sizes available: 5-12"
- Speed of head movement in the X and Y direction
Plane Raze Device SV100 Uniform finish with fine surface roughness
- Superior sanding is achieved by sanding pressure controlled rotation and oscillation head motion
- Sanding after hole plugging
- Deburring and dressing after
- through hole drilling (thick panels
- Dressing after plating, built-up PCB
- Dressing and cleaning of stainless press plates
- Dressing of multilayers
SCB Interconnection Solutions Pvt Ltd (SCB Interconnection Solutions Pvt Ltd)
570, first floor, 1st Main Teacher’s colony Jakkasandra Village, Koramangala Outer Ring Road,, Bangalore, Karnataka - 560034
Share us via
Write a Review
