Bangalore, Karnataka, India
Our Product / Services
LDSS 1/2/4, Specially developed for filament production
The LBA 300 3D is designed and built especially to inspect multicrystalline silicon bricks for PV wafer production.
Reliable detection of microcracks and SiC inclusionsReduction of wire breakage by waferingIncrease of wafer yieldQuick cycle timeLoading manually or automatically (in-line)3D brick modelAnalyzing of ingot crystallization result
LBG 690 / 840 / 1100Developed for multi-crystalline silicon ingots:By removing the contaminated top surface it is possible, when reclaiming the cropped parts, to raise wafer yield of the next crystallized ingot.
Advantages:High throughput with low costsSignificant material waste reductionLess risk of wire breakage for squaringFlat surfaces for further processingSave up to 3% costs of wafer manufacturingMechanical clampingAutomatic grinding process
LDQS 16 / 25 / 36For squaring of monocrystalline silicon ingots
Water based coolant instead of slurry:QUICK, SIMPLE loading and unloadingSimple ingot clampingAutomatic cutting process
Advantages compared to conventional slurry wire saw:Higher cutting speed (fixed abrasive)Less spare and wear parts managementLess investment expenseLess energy consumptionLess footprintLess operating personnel
Atomic layer deposition (ALD) provides a unique method for depositing defect free ultrathin films on surfaces. This technique uses sequential surface reactions to coat substrates with high conformality and precise thickness control at the atomic scale.
Atomic layer deposition (ALD) provides a unique method for depositing defect free ultrathin films on surfaces. This technique uses sequential surface reactions to coat substrates with high conformality and precise thickness control at the atomic scale.The ALD(Atomic Layer Deposition) process consists of sequential introduction of desired precursor vapors with hydroxyl groups, each of which forms about one atomic layer per pulse. Key challenges relate to fast removal of gas in the chamber to enhance throughput as well as activation of Nitrogen to form stoichiometric compounds of nitrides. Nano-Master, with extensive expertise in plasma processing and vacuum technology is able to provide unique solutions on its Plasma Assisted ALD(Atomic Layer Deposition) product line.
EVG offers high precision, fully integrated and highly automated wafer Bond Aligner systems for bonding application such as anodic, silicon fusion, thermo-compression and eutectic bonding.
The alignment and bonding process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
A maximum level of automation and process integration is achieved by the GEMINI Automated Production Wafer Bonding System. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a big choice of process variations like anodic, silicon fusion, thermo-compression and eutectic bonding.
Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.
The LL 156/300 is designed to evaluate material quality quickly and economically. This handy machine helps to guarantee a steady quality of wafers
Mapping of carrier lifetime, photoconductivity, resistivityNon-contact, non-destructive electrical semiconductor characterisationTwo dimensional ingot mapping system for solar grade multi siliconMeasurement time: 2 minutes for two surfaces simultaneouslyOne ingot four sides with handling: 5 6 minResolution 1 mm
LDQS 690 / 840 / 1100 For multicrystalline silicon ingots with the sizes from 690 to 1100 mm (height max. 500 mm)
Water based coolant instead of slurryQUICK, SIMPLE loading and unloadingAutomatic cutting process
Advantages compared to conventional slurry wire saw:Higher cutting speed (fixed abrasive)Less spare and wear parts managementLess investment expenseLess energy consumptionLess footprintLess operating personnel
Valence Process Equipment offers both production and research-sized MOCVD reactor systems for Group III-Nitride and InGaAl-AsP material systems. We can provide a high degree of customization to suit your specific process requirements.
Valence Process Equipment patented, 500-series platform features a non clogging, temperature-controlled showerhead gas injector, and our high symmetry, minimized-volume, non-recirculating pro led reactor, enabling production-level capacities with pilot-level gas and MO usage. Along with high speed wafer carrier rotation, rapid heating capability to 1200C, and high-velocity, uniform- fluid gaps providing efficient heat removal and uniform wall temperatures, the 500-series provides state-of-the-art epitaxial materials properties and uniformities at unbeatable efficiencies.
CAPACITY SPECIFICATIONS:250- series capacity10x2in, 5x3in, 3x4in, 1x6in, 1x8in500-series capacity72x2in, 20x4in, 7x6in, 4x8in
FACILITY SERVICES:208 and 380 VAC, 3- Phase PowerPurified N2, H2, and NH3 GasesCooling Water Recirculation LoopCabinet and Exhaust Ventilation
MATERIAL SPECIFICATIONS:GaN, InGAN, AIGaN, AIN2 in., 3 in., 6 in., 8 in. SubstratesSapphire, Silicon, Silicon Carbide.
Kingstones IonSolar Ion implantation forms high quality PN junctions that improve solar cell conversion efficiency and also significantly simplifies the fabrication processes of various high efficiency solar cells.
Kingstone has designed a new ion implanter specifically tailored to the PV industry IonSolar. On both the wafer handling and beam line modules, IonSolar introduced patented breakthroughs: acurtain-like ion beam that can implant multiple wafers simultaneously, and a waferhandling platform that allows continuous wafer implanting withoutwaiting for wafer exchanges.IonSolar makes possible field retrofittable upgrades of existing solarcell production lines in order to achieve higher efficiency cellmanufacturing.
IonSolar Features
High productivityproduction throughput of 1800 wafers / hour, matching the pacing of existing production lines
Small footprint22m2, fitting into space requirements of existing production lines
Low CoO40% reduction compared to similar systems, allowing for ROI in less one year
The LGG is designed to grind and regroove thewire guides from slurry wafering saws or diamondwire saws to any pitch size.
The machine is designed to regrind OD and regroove the wire guides from e. g. Logomatic (Diamond Multi Wire Saw), Linton, HCT, Meyer+Burger, Themis, NTC-Japan, Toyo and Takatory and all other slurry or diamond wire saws, which need refurbishing of wire guide rolls. This machine can grind OD sizes from 2 13 inches (50-350 mm), with high precision pitch for a length from 100 1000 mm.
Atomic Force Microscope measures the roughness of a sample surface at a high resolution, and performs microfabrication of a sample. Also provides 3D information from simultaneous Scanning Electron Microscopy and AFM pictures.
The SuperFlat AFM combines the power of SEM and AFM. Information on lateral dimensions and material from in-situ inspection can be complemented by precise AFM topographical and frictional information. The tool is flat and compact enough to fit through the majority of SEM load-locks, allowing ease of use and increasing throughput. In addition, its size offers enormous stability and vibration dampening advantages, which are particularly attractive when using the tool ex-situ.Compatible with most of the Scanning Electron Microscopes and FIBs available in the market such as, Carl Zeiss, FEI, Tescan, Jeol, Hitachi, Olympus, etc.
Fully Automatic turnkey line for module productionStringer & TabberLaminatorAuto Framing MachineLASER ScriberEVA Cutting MachineEL TesterCell Sorter and Tester
Argus Solar is the market leader in the solar energy industry, Argus Solar designs and develops manufacturing lines and equipment for photovoltaic panels. The company provides solutions ranging from a 5 MW PV module production line to a 300 MW line, The principle of the PV Turnkey Project of Wuhan Sunic Photoelectricity Equipment Manufacture Co., LTD has always been to take care of every detail in our clients production and reduce labor dependency and land usage so as to create competency for our clients in terms of cost while improving production efficiency and capability. The assembly line consist of: Tabber&Stringer, Auto Lay-up Machine, EL Tester( before/after laminating), Conveyor Units, Auto Laminating Machine, Auto Trimming Machine, Auto Framing Machine, Auto Curing Line, IV Module Tester, Auto Module Sorting Machine and other solar module inspection equipment. This solution with high standard equipment and high automation is in the leading edge of the industry. Nevertheless, the designed assembly line is beautiful and neat with high cost efficiency which allows convenient manipulation and maintenance.
Ultechs CVD are widely used to deposit materials which include: silicon (SiO2, germanium, carbide, nitride, oxynitride), carbon (fiber, nanofibers, nanotubes, diamond and graphene), fluorocarbons, filaments, tungsten, titanium nitride and various high-k dielectrics
Ultechs Chemical Vapor Deposition System (CVD) are widely used to deposit materials in various forms, including: monocrystalline, polycrystalline, amorphous, and epitaxial. These materials include: silicon (SiO2, germanium, carbide, nitride, oxynitride), carbon (fiber, nanofibers, nanotubes, diamond and graphene), fluorocarbons, filaments, tungsten, titanium nitride and various high-k dielectrics. The system general features include;
Piece wafer, 1 wafer/batch
Lamp heater, max.1000
LM type loader (manual moving)
ICP source + RF power 600W
Rotary pump (fomblin oil type)
Manual angle valve
MFC: Ar(500sccm), CH4(500sccm), H2(500sccm)
Manual control (switch panel)
*Type of CVDs offered by ULTECH: Graphene CVD, Hot Wire CVD, CNT remote CVD and Si Nano Wire CVD.
