The Black Diamond II nano-porous low-k film is the industry standard for the 4532nm copperlow-k interconnects, with a k-value of approximately 2.5. Its predecessor, Black Diamond (k3.0), is the industry-standard for the 9065nm nodes. Creating nano-porous low-k film is a two-step process consisting of PECVD deposition of an organosilicate glass backbone and a thermally labile organic phase, followed by an ultraviolet (UV) cure that removes the labile phasethereby inducing porosityand restructures and strengthens the remaining silicon-oxide matrix to form the final nano-porous film. Small average pore size and tight pore size distribution eliminate the need for pore sealing.
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Ananda (Applied Materiald)
3340 Scott Blvd, M/S 0501
PO Box 58039
Santa Clara, CA 95052, United States
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