EB-470 is a thermally conductive, high temperature epoxy adhesive specially designed for heat sink attachment. In electronics, heat sinks are passive heat exchangers that cool a device by dissipating heat into the surrounding medium. In computers,...
United Adhesives Inc. makes thermally conductive adhesives (TCA) for bonding electronic devices with heat dissipations. The two-part products have following features: - High thermal conductivity & heat dissipating capacity - High bonding strength to...
COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. Thermally robust &...