Soldering Equipment

Leading Manufacturer, Supplier & Retailer of Solder Bath.

Solder Bath

Sold Bath Size 4 x 4 x 4 (LBH in inches)
Temperature up to 300oC
Sample Dipping Speed 25 mm / sec
No of Dips 0-9 programmable
Pickle Bath 4 x 4 x 4 (LBH in inches)
Sample dipping automatic using pneumatic arm.
Sample Transfer Automatic using motorized arm to travel between baths.
Dip Time 0-99 sec programmable.

model number: ssi 560 sbt

standard number: iec 60245-2:1994

the test is intended to verify the effectiveness of the separator between the non tinned conductor and insulation.

instrument principle

the test is intended to verify the effectiveness of the separator between the non tinned conductor and the insulation.

the instrument consist of one pickling bath and one solder bath. The solder bath is designed to maintain a temperature of up to 300oc, as to keep the solder in a molten state.

the ample is first dipped in the pickling bath and then dipped in the solder bath for predetermined cycles. The no of dips and the speed of dip can be controlled.

standard

the instrument conforms to iec60245-2 : 1994

instrument

one pickling bath

one solder bath

an automated robotic arm to dip the sample in pickling and solder bath

the arm is also designed to transfer the sample form pickling to solder bath

plc to control the instrument.

hmi for display and interacting with the operator.

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