Hans Laser technology

LBS Marg, Mumbai, Maharashtra

1. Can be suitable for a variety of materials: steel, aluminum, silver, gold, silicon.2. Suitable for various industries:Electronic components industryMedical device industryGlasses, watch and clock industryIC card industryJewelry industry. Utilizes the world's largest source of Fiber lasers-IPG Photonics.2. Adopts the newest generation of laser marking control.3. Integrates the encoder data port which can get the assembly line speed real time that is for flying marking application.4. Adopts one key starting with a simple interface.5. The appearance is compact with a simplified air cooling system.Was developed according to CE and FDA/CDRH standard, meeting the strictest safety requirements.Specification:Model MARS-10J MARS-20JLaser output power 10W 20WWavelength 1064nm 1064nmBeam quality M2

1. Various metal materials, part of non-metal materials.2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.1.Small and compact size, use common air-cooling system.2.Fiber output, can apply flexibly, and easy to make 3D processing system.3.Install backward reflecting isolator, which uses the particularity of wavelength and direction of laser, and the special structure inside the backward reflecting isolator, to block the laser reflected by work piece, in order to avoid the laser enter the laser oscillator again to damage the laser oscillator.SpecificationsModel G20Laser output power 20WFocus lens F160 (standard) F254(optional)Lens type F160 (standard) F254(optional)Marking area 3.9''3.9'' 6.3''6.3''Marking speed 300 characters/sec, height=0.039'' 300 characters/sec, height=0.039''Min. character size 0.01'' 0.02''Min. line width 50m 90m

1. Various metal materials, part of non-metal materials.2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.

1. Marking of electronic products LOGO, model, place of origin and so on.2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d10m.3. PCB marking and cutting. With cold laser processing and small heat-affected zone, it can achieve high quality processing.2. Wide applicable materials range can compensate for the shortage of infrared laser processing ability.3. With good beam quality and small focusing spot, it can achieve superfine marking.4. High marking speed, high efficiency, and high precision.5. No consumables, low cost and low maintenance fee.6. The overall machine has stable performance, supporting long-term operation.Specifications:Machine model EP-15/25/30-THG-SLaser wavelength 355nmLaser power 4W / 7W / 10W /15W / 25WMin. marking line width 10m-15mMarking speed 250 characters/secMarking scope 100*100mm

The laser marking machine can code cigarettes, package cigarettes, strip cigarettes, and cigars, which can play the role of anti-counterfeiting, traceability management and so on. ApplicationCan code (number, text, QR code, anti-counterfeiting code, invisible code, etc.) on cigarettes, packs, strips, cigars, etc. System characterMarking control card: personalized customization can be provided at any time. Exclusive high-performance data processing chip is adopted, which has the ability of marking without gap. With high-strength metal protective structure and excellent heat dissipation performance, it has better protection and uninterrupted working ability than ordinary bare PCB boards;External optical path: fully enclosed optical path system to better protect optical devices from external environment.Marking direction: the laser beam head can be selected downward, horizontally or upward according to the application to meet different application types. The structure of light path can also be customized to meet the light output from other angles.Communication: the equipment is equipped with standard network port, serial port, USB port and extended function bit to facilitate data communication and hardware expansion

HANS UV series products can be used on most materials on normal 3rd level flight marking, especially useful on materials like plastic, PE Bottle, package bag, PVC pipe line, etc. It is also used for data communication marking.ApplicatioinHANS UV series products can be used on most materials on normal 3rd level flight marking, especially useful on materials like plastic, PE Bottle, package bag, PVC pipe line, etc. It is also used for data communication marking. Main ParameterItem ParameterWavelength 355nmPower 5WWorking Frequency 8-200KHzMinimum Code Width 0.15mmMinimum Character Size 0.40mmRepeatability Accuracy 0.01mmStandard Marking Range 100mm100mmStandard Focal Length 1862mm(From laserhead baseboard to focus area)Optional Marking Range 60mm60mmto 360mm360 mmNominal Line Speed 10000mm/sPrinting Code 700 Chars/Sec

Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so on. Marking on the Rigid and flexible printed circuit board (PCBAs). Support 1D barcodes, 2D Matrix, QR codes, logo, batch number marking.

1. Mark barcode, QR code, text, number and other information on PCB;2. Double sided radium carving, using CO2 laser, marking up and down on both ends;3. Coaxial CCD is adopted to realize positioning and code reading functions

1The equipment can realize the automatic loading and unloading, positioning, coding, reading and proofreading, automatic receiving, flipping and double-sided marking of large-size PCBA boards and packaging substrates (inner board, outer board) and other products. 2Optional servo platform: the servo platform transmits power through high-precision ball screws, and is guided by high-precision linear guides, which can complete linear movement. 3. Optional linear platform: a motion control system integrated with linear motors and linear encoders as the main components, featuring high precision, fast speed and high response. 4. Automatic focusing system: high-precision automatic focusing system can ensure the coding quality of products with different thicknesses. 5. Adsorption fixture: Negative pressure adsorption and product board edge pressing structure, effectively ensuring the stability of coding. 6. Optional loading and unloading machine: The equipment is equipped with a customized loading and unloading trolley, which can realize stacking product loading and unloading, can be customized L-frame inclined vertical loading and unloading, and compatible with AGV trolley automatic loading and unloading, effectively improving production efficiency. 7. Optional plate turning machine: The equipment can be equipped with a customized plate turning machine to realize double-sided processing of the product, and can be equipped with a six-axis industrial robot to realize double-sided processing of single coding host or double-sided processing of double coding host in series. Application areas: 1. Used in household appliances, office equipment, automotive circuits and other fields. 2. Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers. Equipment parametersmachine type HDZ-PCB6565ALAdapt to PCB board size Min100100mm MAX650750mmAdapt to PCB board thickness 0.5mm-3mmAdapt to package substrate siz

1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics.2. LCD, OLED screen cutting (C, R, U angle cutting).3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks.Good beam quality, small spot size for ultra-fine marking.2. The heat affected zone is small, avoiding damage to the processed material and high yield.3. Marking speed, high efficiency, high precision.4. No consumables, low cost of use and maintenance.5. The machine performance is stable, long-term operation.Specifications:Machine model EP-IRPS-20Laser wavelength 1064nmLaser power 20W / 10ps / 1000kHzRepeated frequency 1000KHzMarking scope 100*100mmMarking line width 0.03mmMarking depth 0.1mmMin. character 0.06mmMarking speed 7000mm/s

High processing accuracy: Equip with high torque servo motor and high precision imported reducer, high efficiency, favorable dynamic characteristics;Good dynamics & cutting ability: High rigidity welded body with die-cast aviation aluminum gantry, improve the gantry strength and much lighter, enjoy good stability & durability;Easy operation & intelligent: Adopt the professional digital control system, which is developed by Hans MP, achieving the HANS digital control system with the features of good performance, high reliability and convenient operation.

Good dynamics & cutting ability: High rigidity welded body with die-cast aviation aluminum gantry, improve the gantry strength and much lighter, enjoy good stability & durability;Easy operation & intelligent: Adopt the professional digital control system, which is developed by Hans MP, achieving the HANS digital control system with the features of good performance, high reliability and convenient operation.Low running cost: Low accessing gas consumption by precision control, to ensure the low running cost, three kinds of auxiliary gas can be choose freely by customer. Item ParametersProcessing area 3000mm1500mmX/Y axis location accuracy 0.05mm/mX/Y axis repeat location accuracy 0.03mmMax running speed 120m/minMax running acceleration 1.2GMax load of worktable 700kgPower supply 380V/50HZMachine tool weight About 5.5T

-Rigid machine frame lasting for a long time-Precision-guaranteed machine bed-Compatible with laser automation line-Laser power available from 3kW to 20kWRail transit, automobiles, construction machinery, agricultural and forestry machinery, electrical manufacturing, elevator manufacturing, household appliances, food machinery, textile machinery, tool processing, petroleum machinery, food machinery, kitchenware and bathroom, decorative advertising, laser external processing services and other machinery manufacturing Processing industry.

HF fiber laser cutting machine is a well-established product innovated by Hans Smart Equipment Group.Ultra-high speed fiber laser cutting machine, cutting-edge product.-Reasonable operational cost and maintenance-free fiber laser-Ergonomics design, easy-to-maintenance ApplicationRail transit, automobiles, construction machinery, agricultural and forestry machinery, electrical manufacturing, elevator manufacturing, household appliances, food machinery, textile machinery, tool processing, petroleum machinery, food machinery, kitchenware and bathroom, decorative advertising, laser external processing services and other machinery manufacturing Processing industry.

1. With high-performance UV lase and self-developed control software.2. With the high-precision motion platform system and high-precision galvanometer scanner.3. With high-precision CCD positioning systemWith high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCBA product 2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing 3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high 4. The high-precision CCD positioning system can ensure the products processing precision. Application Field: 1. Suitable for precision cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP 2. Applicable for the high-quality cutting of coverlay, PI, FR4, FR5 and CEM materials 3. Applicable for the precise processing of electronic industry like mobile phone fingerprint module, camera module, integrated chip.

1. With high-performance UV laser and self-developed control software.2. With the high-precision motion platform system and high-precision galvanometer scanner.3. With high-precision CCD positioning system.. With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCBA product 2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing 3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high 4. The high-precision CCD positioning system can ensure the products processing precision 5. The machine can be integrated into the production lines and connected to various loading and unloading devices for cutting without manual operation. Application Field 1. Suitable for precision cutting, half cutting, trenching of materials such as FPCBA, PCBA, RF, CVL and SIP. 2. Applicable for the product precise processing of auto industry and electronic industry.

The movement is realized by high-precision linear motor, which drives the X-Y axis to the corresponding position, and the software triggers the light cutting and marking according to the pattern; After all products are cut and marked, there are audible anThe movement is realized by high-precision linear motor, which drives the X-Y axis to the corresponding position, and the software triggers the light cutting and marking according to the pattern; After all products are cut and marked, there are audible and visual instructions. This scheme has the characteristics of high production efficiency, convenient operation, stable performance and good cutting and marking effect. Control mode: Motion control cardCutting mode: CO2 laserAutomation level: Manually feeding, adsorption and fixation, automatic cutting.Other characters: It is equipped with vacuum adsorption platform and exhaust system; It locates the product on the loading platform easily; A smoking pipe is installed near the cutting point to extract the smoke generated during cutting.Application: label, PET film such products SpecificationMotion platform linear platform X axis(300mm), Y axis(300mm), The manual up and down lifting stroke of the worktable is 250mmPlatform precision repeated positioning precision 0.02mmMax processing area 400mm*300mmPower single phase220V/50HZAir source 0.60.9MPaOverall size(L*W*H) 1250mm*2100mm*1750mm

Glass thickness: 0.1-1.2mm2Edge breakage size: 0.005mm3Processing speed: 4s/pcs, 115*60mm, R5mm, DOL

1.Realize X, Y, Z motion control in three directions;2.Real-time controls the rotation of the laser and changes of processing tilt angle;3. By setting different combination of processing parameters, users can realize various irregular drilling.1.Automobile Industryfuel spray nozzle2.Aerospace Industryturbine blade film hole3.Electric Industry---Electric probe card4.Watch Industry---Gear machining, Dial plate micro-hole inlay5.Medical field---Heart stent cuttingFeatures:1. By setting multi-dimensional parameters in control software, to form the machining path, and output any irregular shape and any taper drilling.2. Realize the optical quality of the processed inner wall Ra

Doping sources pre deposited on the surface of silicon wafer (such as phosphosilicate glass PSG, boronSilicon glass (BSG, etc.) is reprocessed to remove impurities on the surface or shallow surface of the filmThe secondary diffusion in the silicon wafer forms PP + and NN + high-low junctions. Main Features532nm green laser, stable and reliable.The new focusing flat top energy distribution optical path transmission system is designed to effectively improve the optical path stability and minimize the damage of silicon substrate;Compatible with existing production lines, easy to upgrade and high reliability.

Mainly used for laser pattern processing of solar screen printing PI film material screen or stencil removal for meshless screen productionGood processing quality: no burning, no glue residue, good line width consistency in film cutting; no residue in steel mesh cutting, less dust adhesion;High flexibility: Compatible with conventional screen and non-knotted screen, you can choose a variety of cutting methods;High precision: high-precision CCD positioning system + high-precision XY platform (repeated positioning accuracy 1um).

With the rise of photovoltaic double-glass modules, the demand for drilled back glass is increasing, With the rise of photovoltaic double-glass modules, the demand for drilled back glass is increasing, and the drilling quality has become a key process link affecting the production of back glass. In response to the low-cost drilling requirements of thin glass, Han's Photovoltaic Equipment has developed high-precision, high-efficiency precision laser drilling equipment. Main FeaturesCompatible with mainstream glass specifications (600*12001200*2500mm, thickness 1.6-5mm);The equipment includes acceleration section, rotation section, laser drilling section, rotation section and deceleration section;Compatible with long-side feeding (shingled type) and short-side feeding (conventional);The processing cycle is as fast as 6 pieces/min (diameter 12mm, thickness 2mm);Using highly stable laser, the process effect is stable.

Suitable for thin film batteries such as CIGS, CdTe, perovskite, and color-changing glass.Mainly used in P1/P2/P3 laser scribing of thin film solar cells, and laser insulation scribingThe thin film battery is divided into small pieces by laser scribing and connected in series at the same time, so as to reduce the loss of electric energy and increase the output voltage Main featuresThe processing quality is good, cut without residue and does not hurt the bottom. The line width is consistent, and the process flow is stable;Different processing graphics;Multi-head simultaneous processing, high processing efficiency.Main ParametersBasic function Thin-film solar cells P1/ P2/ P3/ laser scribing/ P4laser edge cleaning (select laser corresponding to different processes)Can customize thin film solar cell/BIPV/smart photovoltaic glass solutionLaser generator lifetime 10000 hoursWork hole diameter 1500mm/sThe position of the holes that can be machined multi-channel simultaneous machiningMinimum center distance of machinable holes Round, square spotMachining hole position accuracy 0P1: 20-60um, P2: 40um-80um P3: 40um-80umLaser power >2MHole appearance requirements >1G@1KV

PERC&IBC, suitable for single and polycrystalline silicon cells.532nm green laser, stable and reliable;Groove can be freely set according to requirements: solid line, dotted line, dot, etc.;Double-line structure, high degree of automation, to achieve the upgrade of existing production lines, low cost and high reliability.Main ParametersProject Technical indicatorsSpot size 355um roundProcessing graphics, graphics accuracy solid line, dotted line, dot matrix, 15umProcessing battery size 156mmx156mm210mmx210mmMachine capacity 7200-9000p/h@182mm (standard machine); 6500-7000p/h@210mm(standard machine); customizableLaser generator life 20000 hoursFragmentation rate 0.03%Industrial camera for pre-inspection of material 10 million pixels; optional for post-inspectionPositioning accuracy Positioning deviation: 30um

main components: a variety of lasers are optional, with high airborne intensity and optimized cutting surface.Half chip is one of the most effective ways to improve the power of photovoltaic modules at present. By dividing the whole cell into half chips, the string current is reduced, so as to reduce the power loss of series resistance, in order to achieve the effect of improving the power of modules. According to the current mass production data of the first-line photovoltaic module factory, the power of half module is increased by 6 7W, and the effect is remarkable. ApplicationThe automatic laser splitting machine is used for the automatic production of high-efficiency photovoltaic modules.The scribing module can reduce the string current and reduce the resistance loss, so as to improve the output power of the photovoltaic module.Main ParametersEvent laser nondestructive cutting remarksbasic function Automatic laser non-destructive cutting and scribing Scribing function Multi-scribing switching is optional for process 2 (Scribing 2 6) Cell size 156 x 156 230x 230 thickness 120 300u m Capacity (scribing 2) 10000P/H Fragment rate 0.03% or 0.05% Startup rate / failure rate/ 98%failure rate2%

The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machineThe core principle of non-destructive laser cutting is laser thermal stress controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the material surface, so as to induce the generation of thermal stress, and induce the stable fracture of the material through appropriate control of thermal stress. Non destructive laser cutting can realize low-temperature processing and avoid the ablation damage of solar cells. Main Featuresthere is no laser thermal damage on the battery section and no laser thermal influence on the surfacegood mechanical performance and high conversion efficiency;maximum capacity 7200p / h, multiple configurations are optional;widely compatible with mainstream and new crystalline silicon battery products;ndependent intellectual property rights, multiple core patents.

Low-pressure diffusion is currently considered to be an effective way to effectively improve the conversion efficiency of solar cells. Low-pressure diffusion is currently considered to be an effective way to effectively improve the conversion efficiency of solar cells. Low-pressure diffusion/scattered oxidation annealing improves the molecular free path of the diffusion source and solves the problems of diffusion depth and uniformity; compared with atmospheric pressure diffusion, it has some significant advantages, such as high productivity, high square resistance, process repeatability, Low source consumption, clean and environmentally friendly, etc. This equipment is mainly used for the diffusion doping and oxidation annealing process of silicon wafers in the manufacture of crystalline silicon solar cells. Main Features Mature high-capacity process, loading and unloading system: balanced and symmetrical design to enhance stability; Rapid cooling furnace body: The latest patented technology makes the furnace body temperature drop to the required temperature quickly, the cooling rate is increased by more than 25%, which can improve the temperature uniformity in the furnace tube obviously; The exhaust gas is collected by high-efficiency water-cooled condenser to ensure stable and reliable operation of pipes, valves, filters and diaphragm pumps and long maintenance periods; Stable design of anti-interference source pipeline to reduce square resistance fluctuation caused by disturbance of environmental factors; MES/CCRM system with complete architecture and outstanding performance.

It is suitable for semiconductor and photovoltaic fields. For TOPCon process cells in the photovoltaic field, LPCVD equipment can complete the preparation of tunnel oxide layer/poly layer in one stop. The combination of thermal oxygen and poly layer deposIt is suitable for semiconductor and photovoltaic fields. For TOPCon process cells in the photovoltaic field, LPCVD equipment can complete the preparation of tunnel oxide layer/poly layer in one stop. The combination of thermal oxygen and poly layer deposition can greatly increase production capacity, while compatible with i/d-Poly growth process. Main FeaturesMature high-capacity process, dual-mode temperature control technology, film gauge protection technology;With a variety of coating technologies: multi-layer composite film, doped polysilicon technology;Patented rapid cooling furnace body: The latest patented technology makes the furnace body temperature drop to the required temperature quickly, and the cooling rate can be increased by more than 25%, which can improve the temperature uniformity in the furnace tube obviously;Fast adaptive pressure closed-loop control technology;MES/CCRM system with complete architecture and outstanding performance;Integrated industrial computer + Modular process control software;Comprehensive power failure safety treatment and abnormal protection of flange water.

Laser resistance modulation locates a very thin laser beam on the thick film resistor, the beam cuts the resistor according to the computer predetermined program, and changes the resistance value by changing the cross-sectional area of the resistor.Laser resistance modulation locates a very thin laser beam on the thick film resistor, the beam cuts the resistor according to the computer predetermined program, and changes the resistance value by changing the cross-sectional area of the resistor.At the same time of laser cutting resistance, the resistance value is measured in real time through the high-speed measurement system to keep it close to the target resistance value.When the resistance reaches the target value, the laser beam is turned off, so as to realize the precise adjustment of the resistance.The laser resistance modulation system has a variety of adjustment functions, which can adjust the thickness of thin-film resistor network, capacitor network, ceramic based thin-film integrated components and realize the function adjustment of hybrid integrated circuits. System CharactersThe self-developed PMU measurement system has high precision, fast speed, good consistency, full range design and full range resistance regulation.The self-developed resistance regulation software system supports varies of different kinds of resistance adjustment knife types and meets the customized requirement at the same time.The equipment has powerful functions and supports the adjustment of parameters of resistance, AC and DC voltage and currentThe equipment is stable and reliable, and the reliability of the repaired and adjusted values of product parameter is high and will not driftLow operation and maintenance cost, high efficiency and low energy consumption. It is equipped with dust-proof, anti-static, leakage protection and personal safety protection functions, it can be used safely

The laser welding system of motor stator core is a semi-automatic equipment designed for laser welding and forming of stator core of block DC motor;The laser welding system of motor stator core is a semi-automatic equipment designed for laser welding and forming of stator core of block DC motor;The laser welding machine adopts 4-way fiber transmission, manual feeding, automatic pressing into the fixture, rotating for 3 times, and completing 12 welds.It is equipped with Ventilation system, dust removal, safety protection and other functions. Industrial control system, friendly man-machine interface, simple operation, stability and reliability System CharactersThe energy of laser beam is concentrated, welding speed is fast, post welding deformation is minor, heat effect zone is small4-way fiber transmission and 4 welding joints equipped, welding at the same timeThe double claw structure realizes the feeding and blanking at the same time, improving efficiency.High welding precision. Automatically popping up from the fixture makes the automatic feeding convenient. Industrial control system, friendly man-machine interface, simple operationEquipped with protection cover, access control and safety interlock, operation safety secured.

The sensor welding system is a solution for the assembly and welding of three parts: sensor pressure ring, sensor sheet and sensor core base. In view of the lack of coordination in the assembly of sensor products and the high demand of coaxiality, specialDouble worktables, increasing output.Strong university, the replacement of fixture is simple and can be compatible with different products with different outer diameters, Equipped with dust extraction function to reduce the welding smokeEquipped with air blowing protection to ensure the effect of welding surfaceIndustrial control system, good man-machine interface, simple operationFully enclosed safety protection cover, set up access control and safety interlock to secure operation safety.

The system is mainly used for laser welding of components of wearable products.The system is mainly used for laser welding of components of wearable products.Equipped with a 5-dimensional electric platform, the system can realize the welding of multiple planes of components. It has obvious advantages for the welding of nonlinear components.The system is also equipped with CNC operating system, which is convenient to control. System charactersThe special fixture of the system has ingenious design, high positioning accuracy and high yieldThe system conforms to the ergonomic structure, and the software is humanized and easy to operate and useThe system has good compatibility, can replace fixtures to realize the production of different sizes. Product advantagesThe equipment can be switched quickly for products of various specificationsAutomatic track adjusting device.High performance, high cost performance ratio, Customization based on customers requirement

The system integrates automatic feeding module, CCD positioning before welding, high-speed solder ball jet welding module, post welding AOI detection, automatic blanking module, etc. Combined with general or customized clamping tools, it can realize soldeThe system integrates automatic feeding module, CCD positioning before welding, high-speed solder ball jet welding module, post welding AOI detection, automatic blanking module, etc.Combined with general or customized clamping tools, it can realize solder ball jet welding and AOI post welding detection of different types of products.The solder ball welding speed of the system can reach 5 balls per second, which has the advantages of high speed, stable amount of tin, non-contact welding and no flux.The self-developed fiber laser cooperates with the automatic nozzle alignment system to realize the full-automatic focus finding and position alignment of the high-speed solder ball system, save the nozzle replacement time and improve the nozzle service life and spray position accuracy, It is widely used in solder ball spray welding of precision mechanism parts in 3C electronic industry.

As laser is being more and more widely used in all fields, the handheld welding system emerges as the times require. High power fiber laser welder equipped with portable welding gun makes the operation simple and flexible, which can be applied into multiAs laser is being more and more widely used in all fields, the handheld welding system emerges as the times require.High power fiber laser welder equipped with portable welding gun makes the operation simple and flexible, which can be applied into multi metal materials, such as thin stainless sheet, iron sheet and galvanized sheet, especially for the complex and irregular welding process which can perfectly replace the traditional argon arc welding, electric welding such processes. System charactersFast welding speed, higher welding efficiency than the traditional oneSimple operation, can weld any position and any angle of the workpiece.Suitable for welding small batch and multi angle sheet metal and hardware partsEquipped with safety circuit to avoid false light, the operation is safer.Compact structure and small occupied spaceIntegrated design, ultra long fiber transmission, overcoming the limitations of distance operation.

The WFD series is a diode laser that uses diode materials to illuminate between energy bands. Two parallel mirror surfaces inside the diode are formed as a resonant cavity, which illuminates the light, and outputs laser of wavelength 915 nm.With fiber t. Pulsed, continuous dual working mode;2. A more diverse way of working;3. Low maintenance cost and low power demand, zero consumables, electro-optical conversion efficiency up to 47%;4. Better integrated applications for on-site placement and integration;5. Compact structure space makes handling, management and maintenance more convenient and free. Application: Widely applied to the reinforcement and sealing welding of plastics Medical plastic parts.1. Auto plastic parts.2. Plastic bottle sealing welding.3. Plastic pipe sealing welding.4. Oxygen mask sealing welding.

W150G utilizes a laser source that excites Nd: YAG crystal using a pulsed Xenon lamp that resonates to create a laser with a wavelength of 1064 nm. With good beam quality, fine laser spot, strong penetration, and fiber transmission, an excellent non-coHigh aspect ratio, thin weld width, narrow heat affected zone, zero deformation, and fast welding speed.2. The weld is smooth and clean, with or without simple process after welding.3. High weld strength, no porosity, eliminates the impurities of the base metal, the microstructure can be refined after welding, the weld strength is at least equal to or even exceed the base metal strength.4. Tiny laser spot can be precisely positioned and easily automated.5. Fit for some dissimilar metal welding.6. Spot welding, butt welding, overlap sealing welding.7. Various metals such as gold, silver, platinum, stainless steel, titanium, and their alloys.

It is commonly applied to mold manufacturing industries including mobile phone, digital product, automobile and motorbike.Laser welding spot diameter is small, heat affected area is small and pore, collapse, thermal strain and metallographic structure change will not occur after welding, greatly decreasing post-welding treatment process.2. Microscope co-axis observing focusing positioning aiming, liquid crystal light valve and full reflection eye protection devices.3. Stable operation, the ability to realize continuous working and intermittent working.4. XYZ high rigid worktable, high repeated positioning precision.5. It can effectively repair all cracks, chips and damages.

FP series is a new generation near-infrared semiconductor pumped fiber laser. With good beam quality, fiber transmission and high electro-optical conversion efficiency, It is mainly used for rapid welding thin materials.. High aspect ratio, thin line weld width, narrow heat affected zone, zero deformation, and fast welding speed.2. Smooth and clean weld with or without simple process after welding.3. High weld strength, no porosity, eliminates the impurities of the base metal.4. The microstructure can be refined after welding, Weld strength is at least equal to or exceeds base metal strength.5. Tiny laser spot can be precisely positioned and easily automated.6. Suitable dissimilar metal welding.7. Excellent for spot welding, butt welding, overlap sealing welding. Applications:Battery welding, pipe welding, thin steel plate weldingElectronic components, instrumentation, medical equipment, small metal parts welding Material, Stainless Steels, Carbon SteelsGold & Silver, Aluminum, Tool SteelsNickel Alloys, Brass & Copper, Titanium

The machine is mainly used in the assembly and welding of the fixed structure parts of the back cover camera of IT products such as mobile phones and PAD.Modular design better for machine maintenance, more than 87% OEE data.2, Well designed machine structure and its related fixture, product yield is over 99.5%.3, The whole machine design is compact and reasonable, with 9.5s processing CT.4, Data processing and transmission are stable with success rate of over 99.5%.

, Precise positioning to correct customer abnormalities.2, Double station operation, 136 solder joints, CT < 80s.3, Human-machine interaction interface, simple and easy to operate.

1, High precision, precise pick and place, 8 materials flipped, laser marking on 3 sides synchronously.2, High efficiency, 4 stations linkage, marking time 1.12pcs/s.3, Strong stability, 99% product yield under high-speed operation.Item Specification Dimension 3000*1400*1900 Power supply 3 phase, 220V Air pressure 0.4-0.7MPa Power consumption 4KW Height for operation table 1200mm Human-machine ratio 1:1

Adjustable repetition frequency, ranging from 20kHz to 200kHzIntegrated design of optical and control systemTEM00 outputAs a new product with innovative design, it adopts proven intra-cavity frequency doubling technology and has been applied to various precision marking processes in batches. As UV laser breaks through the power limit and has unique super-high cost performance, its application is rapidly increasing and will have a breakthrough in the field of extreme manufacturing. ApplicationsMarking of high-end electronic product LOGOMarking of food, PVC pipes, pharmaceutical packaging & cable wire (HDPE, PO, PP, etc.)PCB & EPC QR code markingMetallic or nonmetallic coating removalMarking of air switch & low-voltage electrical appliances (flame-resistant materials)

Adjustable repetition frequencyModular designTEM00 outputHigh average power output, up to 30WLeveraging the extremely small heat-affected zone of "cold processing", it can achieve ultra-fine processing and microstructure production of non-metallic brittle materials in the high-end manufacturing fields, which is widely used in the 3C industry, especially in the key processes of cellphone industry chain. At present, more than 15, 000 machines have been launched, leading the market share of similar lasers. Applications1. PCB, FPC marking, de-panel, cutting and drilling;2. Silicon wafer micro-hole and blind hole processing;3. Solar cell process4. Silicon wafer scribing5. Ceramic scribing, cutting and drilling6. Removal of printing ink, PVD coating7. Material surface marking

All-fiber modular design, suitable for industrial 7x24 hours high power and high stability. Pulse width 500fs, power 50W, single pulse energy 200J & adjustable range (50kHz-4MHz) of repetition frequency.Good spot mode;High stability;Burst pulse number: 1-16 ApplicationsCutting and drilling of brittle materials such as glass, sapphire, ceramic, etc.Cutting and drilling of thin-film materialsSensor marking & etchingMetal surface treatment, such as removal of black copper layer & fine marking of metal surfaceHyperfine processing of human implant materials, such as cardiovascular stents cuttingTwo-photon micro-nano processingDental repair, etc.

Die Bonding Speed 180ms/cycleDie Bonding Position Precision 1.5mil(38m)Bonding Force 20-200gMaximum Stroke of Wafer Platform 8 x 8 (203mm x 203mm)Worktable Stroke 5.5 x 16 (406mm x 140mm)Wafer Size 4x6"/1x8"wafer ring(optional)Applicable chip 5-80milServo Driver 100W/200WVision System Digital image pattern recognition 0.54.5 continuous variable cameraCapacity UPH up to 20K/h

Product features: 1. Organic combination of additive manufacturing and subtractive manufacturing; 2. Can perform powder coating additive, milling, grinding and polishing composite processing; 3. Equipped with a knife magazine, automatic tool changing a Categories Metal powder energy deposition equipment (LMD)

Direct drive, high dynamic response;2.High accuracy;3.Integrated BISS-C interface absolute position feedback.